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EAK Core Solutions: Chip-Level Thermal Simulation and Dynamic Power Load Validation

Chip-level thermal simulation and dynamic power load validation

Against the backdrop of explosive growth in AI computing power, the deployment of million-scale GPU clusters faces unprecedented power supply and thermal management challenges. Wafer fabs, server OEMs and data center operators cannot conduct limit tests upfront using real computing modules that cost hundreds of thousands of US dollars apiece. Under such circumstances, EAK’s product line for chip-level thermal simulation and dynamic power load verification serves as a critical link across the industrial chain.

Why are precision test vehicles required?

Power supply and thermal management are two sides of the same coin. High-density liquid cooling systems must verify power supply stability and thermal limits under real operating conditions. Traditional approaches suffer from high costs, significant risks and poor repeatability. EAK’s products are built precisely for this purpose: they accurately mirror the thermal behavior and power characteristics of actual computing hardware, enabling customers to complete comprehensive verification before physical hardware deployment.

1. Computing Power Emulation Thermal Test Vehicle（Thermal Test Vehicle, TTV）

EAK TTV is a test chip/module that delivers precise 1:1 emulation strictly following the physical dimensions, heat-generating zones and power distribution of NVIDIA Blackwell (GB200/GB300) and next-generation architectures. While it is not a genuine GPU, it can perfectly reproduce transient thermal characteristics ranging from 1000W to over 1400W, making it an essential tool for high-density data center R&D.

EAK TTV supports a power density of 500 W/cm²; up to 1000 W/cm² with special processes.

EAK thermal test vehicle for chip-level heat simulation

Core Product Advantages

  • 1:1 Architecture Emulation: Precisely matches the dimensions, thermal mapping and transient power characteristics of target chips. It enables independent control of multiple hotspots to realistically simulate thermal behavior under AI training and inference loads.
  • High Transient Power Capability: Easily delivers peak power of 1000W–1400W+. Supporting dynamic power loads, it verifies the performance of cold plates, TIM materials and liquid cooling systems under extreme operating conditions.
  • Precise Measurement & Repeatability: Equipped with integrated multi-point temperature sensors to supply high-precision thermal resistance and thermal capacitance data. Highly repeatable test results greatly reduce uncertainties in R&D.
  • Safety & Cost Benefits: Eliminates destructive testing on costly genuine GPUs, significantly shortening validation cycles and mitigating risks in early-stage development.
  • Modular Design: Supports single-chip or multi-chip module configurations, and can be readily integrated into server motherboards or test racks.

Key Application Markets

  • GPU / Accelerator R&D: Used by wafer fabs and chip design companies for thermal characteristic validation of next-generation architectures.
  • Server OEMs: Motherboard power supply design and liquid cooling cold plate compatibility testing.
  • Data Center Operators: Validation of rack-level and cluster-level liquid cooling systems.
  • Liquid Cooling Solution Providers: Performance optimization and certification of CDU, cold plates, secondary loops and other products.

2.High-Density Liquid-Cooled Load Bank（Liquid-Cooled Load Bank）

Traditional air-cooled load banks are bulky and incapable of simulating real operating conditions of liquid-cooled racks. EAK High-Density Liquid-Cooled Load Banks adopt kilowatt-class ultra-thin, low-inductance resistance technology. They can be directly installed into standard server racks and accurately emulate real computing power consumption, serving as core equipment for validating power supply and liquid cooling systems across data centers (including CDU, secondary loops and power distribution).

EAK high-density liquid-cooled load bank

Core Product Advantages

  • Native Liquid Cooling Compatibility: The ultra-thin form factor fits seamlessly within liquid-cooled rack enclosures. It emulates the flow resistance and heat exchange characteristics of real servers, eliminating the need for test environment modifications.
  • High Power Density: Each module supports over 20 kW and delivers dynamic load capability (transient / steady state), accurately reproducing power fluctuations of GPU clusters.
  • Low Inductance & High Reliability: This resistor technology ensures fast response and long-term stable operation while reducing electromagnetic interference to the power supply system.
  • System-Level Verification Capability: Units can be paralleled to build larger-scale test systems for comprehensive validation of power supply chains, CDU flow and temperature difference control, secondary loop stability and more.
  • Flexible Deployment: Rack-mounted installation enables easy scalability, supporting remote monitoring and automated test sequences.

Key Application Markets

  • Data Center Construction & Commissioning: Acceptance testing for power and liquid cooling systems in new facilities to mitigate risks before deploying production hardware.
  • Liquid Cooling Infrastructure Validation: End-to-end performance verification for CDU, cooling towers, heat exchangers, pump packages and other components.
  • AI/HPC Cluster Deployment: Power and thermal load stress testing prior to launching large-scale GPU clusters.
  • Power Equipment Manufacturers: Stability validation of PDUs, UPS systems and busbar systems under high transient loads.

EAK: A Reliable Partner Empowering the High-Density Computing Era

From chip-level thermal simulation to system-level power load validation, EAK’s two core product lines form a complete verification closed-loop. We empower upstream and downstream industry players to conduct R&D and deployment safely and efficiently on Blackwell and next-generation computing platforms.

Whether for chip manufacturers pursuing extreme performance or data center operators optimizing PUE, EAK’s tailored solutions effectively mitigate project risks, accelerate verification cycles, and substantially enhance the reliability of final deployed systems.

Amid the wave of AI infrastructure development, choosing EAK means opting for a smarter and safer testing path.

Need a test solution matched to your actual operating conditions? Share your power range, cooling method and application scenarios, and the EAK engineering team will assist with configuration.

 

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