Blog
EAK TTV: A Key Tool for Accurately Simulating DIMM Heat Generation and Accelerating Server Thermal Validation
Driven by AI and high-performance computing (HPC), server power density keeps rising. Besides CPUs and GPUs, DIMMs have become a major heat source. When multiple high-bandwidth DDR5 modules run in parallel under full load, they generate substantial heat. Insufficient cooling can easily trigger throttling, degraded stability and even system failures. The TTV (Thermal Test Vehicle) […]
EAK Core Solutions: Chip-Level Thermal Simulation and Dynamic Power Load Validation
How EAK TTVs and liquid-cooled load banks support safe, repeatable validation from chip-level thermal behavior to data-center power systems.