This product is packaged in a TO-220 format (ceramic substrate enlarged version). It does not use a copper base plate, but instead directly employs compression molding for encapsulation, which increases the effective area of the ceramic substrate (and the corresponding effective area of the resistance layer), thereby enhancing the resistor’s ability to withstand strong pulse electrical loads.
TO-220 TO-247 SOT-227 Series
TO-220 Packaging Thick Film Non-Inductive Power Resistor
The center temperature of the base plate is ≤25°C with a rated power of 50W. It features a standard TO-220 compression molded package with the ceramic substrate exposed. The M3 screw installation, combined with a dedicated mounting spring clip, overcomes the weakness of insufficient mechanical strength of the molded resistor body, allowing the pressure of the fixing screw to act directly on the center of the resistor body, thereby enhancing the thermal conductivity of the resistor.
Category: TO-220 TO-247 SOT-227 Series
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