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Ceramic Carbon Resistors / Ceramic Composition Resistors

PCB Energy Absorption Resistor

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Category: Ceramic Composition Resistors

Description Specifications

The CSP series of PCB energy absorption resistors are manufactured from inorganic materials such as graphite and Al₂O₃, which are sintered at high temperatures to form a solid core. The resistive element uses a semiconductor mechanism, ensuring low inductance suitable for high-frequency applications. The surface is encapsulated with epoxy resin, providing excellent sealing and moisture resistance. These resistors can absorb random strong pulse energy release within a short time, making them ideal for applications such as power transmission, electric traction, pulse power sources, and induction heating.

Technical Features

  • Low Inductance : Suitable for high-frequency applications with negligible parasitic inductance.
  • PCB Plug-in Design : Easy installation and integration into printed circuit boards.
  • Compact Size : Space-saving design for efficient board layout.
  • High Pulse Load Capacity : Capable of handling large transient energy spikes.
  • UL94-V0 Compliance : Material meets the UL94-V0 flammability standard, ensuring safety.
  • RoHS Compliance : Complies with RoHS regulations, ensuring environmentally friendly manufacturing.
  • Material : High-temperature epoxy resin coating ensures a smooth, hard surface with good appearance.
  • Durability : Long-term operation at temperatures above 150°C may cause minor decomposition or color changes in the surface coating, but this will not affect the resistance performance.

Product Characteristics

  • Load Stability : At rated power, after continuous operation for 1000 hours, the resistance change is ≤ 5%.
  • Temperature Characteristic : Between -55°C and +125°C, after 10 cycles, the resistance change is ≤ 2%.
  • Humidity Test : According to IEC 60068-2-20, Method 103, the resistance change is ≤ 3%.
  • Overload Test : At 10 times the rated power, for a duration of 5 seconds, the resistance change is ≤ 2%.
  • Temperature Coefficient : -500ppm/°C ~ -1500ppm/°C.
  • Thermal Expansion Coefficient : 5-15ppm/°C.

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